Description:
Job Title: Specialist, Mechanical Engineer (Electronic Packaging)
Job Code: SAS20221912-94896
Job Location: Rochester, NY
Job Description:
L3Harris is seeking a Mechanical Engineer to be part of our growing mechanical packaging product development team; interested in developing mission critical products that matter.
Essential Functions:
Design and Development of rugged, high performance, complex electro-mechanical hardware and packaging for harsh environments.
Executing design engineering trade studies in a structured, detailed manner, within a cross functional environment to identify and recommend solutions meeting technical, cost, quality and schedule requirements.
Development of innovative packaging solutions that solve challenging size, weight, and power requirements.
Project management of mechanical packaging sub-system design teams from concept development through production release, qualification testing and delivery.
Delivering functional designs robust to the variation of fabrication, assembly, and materials; as well as the product’s operational, launch, test, and integration environments.
Proactively seeks knowledge and design feedback from relevant organizations and individuals across the products value chain and incorporating lessons learned into active and future designs.
Initiates, leads, and participates in, technical, process, assembly, and test peer reviews of designs.
Supporting, brainstorming, and/or leading lean improvement initiatives to reduce waste and improve efficiency of L3Harris.
Qualifications:
Ability to obtain security clearance.
BS in Mechanical Engineering from an accredited college/university
(4) years minimum experience working as a mechanical engineer.
Experience in the area of assembly design and packaging of physical components.
Experience in CAD 3D Design/Modeling techniques.
Excellent Communication skills and interpersonal skills.
Ability to work independently or within a multi-disciplined team environment.
Experienced presenting Design Reviews to team leaders.
Experienced in the application of ASME Y14.5 GD&T.
Knowledge of design practices with respect to tolerances, variation of material properties, and DFMA.
Experienced in working as part of a mechanical design team and leading small teams of MCAD Designers and mechanical engineers.
Preferred Additional Skills:
Experience electro-mechanical packaging and engineering of Rugged Electronics Packages.
DFMA Analysis.
Tolerance Stack-up Analysis.
Design, Schedule and Cost Estimating for Proposals experience
Proficient in PTC CREO.
Direct experience with mounting circuit card assemblies (CCA) into rugged lightweight enclosures.
Knowledge of ESD/EMI use of gaskets, coatings, connectors desired.
Photosensitive detectors, thin film coatings, & adhesives experience.
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